3D chipsScientists at university of Rochesterb have designed 3 dimensional processor. These kinds of processors are based upon 3 dimensional circuits in opposing to 2-dimensional circuits of these days. This can be declared as the next major astonishing advancements made in the computer processors technology. The recent 3-D processor is operating at a 1.4 gigahertz in the labs of university. Scientists were just developing a stack of normal processors in the past attempts on developing 3-D chips. However at university of Rochesterb it was built and developed purposely to optimize all key processing operations vertically, through several layers of processors, the similar way ordinary chips optimize operations horizontally. This design indicates that each jobs such as power distribution, synchronicity and long distance signaling are all fully operating in three dimensions for the first time.

Do you want to know who developed this 3-D processor? Eby Friedman and his students has developed this chip, which employs several number of tricks compared to the normal processors, and also accounts of various impedances which might happen from chip to chip, various operating speeds and varying power needs. Eby Friedman is the professor of electrical and computer engineering at Rochester and faculty director of the professional of the processor. According to him, he calls it a cube now, since it is not just a chip anymore. This is the technique computing is going to be completed in future. Whenever the chips are blush against each other, they can perform things which you can never perform with a normal 2D chip.

The difficulty associated with present technology of integrated circuits is that, ahead of the limit it is not easy to pack more chips subsequent to each other which restrict the potential of future processors. Therefore number of integrated circuit developers predicts someday extending into third dimension with stacking transistor on the top portion of each other. Vertical expansion of chips possesses lot of technical problems and the only resolution to this is to develop a 3-D chip where all the layers get interact with the specific system. Friedman also tells that getting all the three levels of 3-D chip to act in synchronization is like attempting to device a traffic control system for the whole United States and then layering two more united states above the primary and somehow obtaining each bit of traffic from any point on any level to its destination on any other level when simultaneously managing the traffic of plenty of other drivers.

Now if we substitute the two United States layers to something more difficult like china and India where the driving roads are laws are quite different, and the complex and challenge of developing a single control system to operate in any chip beings to become evident. The 3-D chip is successfully a whole circuit board folded up into small package. Due to this technology the chips present inside looks something like an iPod could be easily compacted to the 10th of its present size along with ten times of the speed.